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   Special Reports

Easier And Faster Ways To Train AI

By: Bryon Moyer

Simpler approaches are necessary to keep pace with constantly evolving models and new applications.
ZHZX Teeth Teaching Model, Teeth Model Study, Full Disassembly T

By: Mark LaPedus

Higher density of interconnects will enable faster movement of data, but there's more than one way to achieve that.
HBM3: Big Impact On Chip Design

By: Ann Steffora Mutschler

New levels of system performance bring new tradeoffs.

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Top Stories

End In Sight For Chip Shortages?

Some segments are normalizing, others may be impacted through 2022.

The Race To Make Better Qubits

How dopant atoms could make qubits that last much longer.

A Broad Look Inside Advanced Packaging

JCET's CTO talks about the slowdown in Moore's Law and the growing interest in new pack...

Zonal Architectures Play Key Role In Vehicle Security

Will zonal architectures in automotive applications provide unique benefits to cybersec...

AI/ML Workloads Need Extra Security

Faulty models, poison code, and corrupt data could cause widespread disruption.

What Is An xPU?

Almost every letter of the alphabet has been used to describe a processor architecture,...

Improving Power Efficiency In Ultra-Low Power Designs

How to design a device with a 25-year battery life.

Changing Server Architectures In The Data Center

Sharing resources can significantly improve utilization and lower costs, but it's not a...

Debugging Embedded Applications

Software and hardware interdependencies complicate debug in embedded designs. New appro...

Enablers And Barriers For Connecting Diverse Data

Integrating multiple types of data is possible in some cases, but it's still not easy.

More Errors, More Correction in Memories

New technologies increase the cost of accuracy as density increases.

Coping With Parallel Test Site-to-Site Variation

Why this is a growing problem, and how it's being addressed.

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Latest News

Blog Review: Nov. 17

Decarbonizing compute; HBM3; 10 years of ISO 26262; space debris.
TMP1105 2.5 Modulus 30Teeth 2.5M30T 15/17/18/20/22/25/28/30/32/3 AMD’s fan-out bridge GPUs; TSMC's fabs; SMIC shakeup; GaN.

Week In Review: Design, Low Power

Desktop FPGA prototyping; 14nm LPDDR5X; data center SSDs; quan...

Week In Review: Auto, Security, P...

U.S. mandates impaired-driver tech; Rivian goes public; touchs...

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Research

Manufacturing Bits: Nov. 16

New hybrid EUV photoresist; antibody therapeutics.

Power/Performance Bits: Nov. 16

Light-emitting memory; random number generation; finding ferro...
St Christopher Challenge Coins, Saint Christopher Medal for Men, Plasma R&D with quantum computing; better logistics; batteries.

more research »



Startup Corner

Startup Funding: October 2021

55 companies raise $2.5B; IC manufacturing and AI accelerators...

more startups »

Videos

Growing Challenges With Wafer Bump Inspection


Low-Power Always-On Circuits

Knowledge Centers / Entities, people and technologies explored